mb05s thru mb10s 0.5 amp single phase glass passivated bridge rectifier 50 to 1000 volts features mechanical data mcc part number device marking maximum recurrent peak reverse voltage maximum rms voltage maximum dc blocking voltage mb05s mb05s 50v 35v 50v mb1s mb1s 100v 70v 100v mb2s mb2s 200v 140v 200v mb4s mb4s 400v 280v 400v mb6s mb6s 600v 420v 600v mb8s mb8s 800v 480v 800v mb10s mb10s 1000v 700v 1000v electrical characteristics @ 25 o c unless otherwise specified average forward current i f(av) 0.5 a (2) 0.8 a (3) see fig.1 peak forward surge current i fsm 35a 8.3ms, half sine maximum instantaneous forward voltage v f 1.0v i fm = 0.4a; t a = 25 o c maximum dc reverse current at rated dc blocking voltage i r 10 0u a t a = 25 t a = 125 typical thermal resistance r th ja r th ja r th jl 85 /w (2) 70 /w (3) 20 /w (2) per leg typical junction capacitance c j 13pf measured at 1.0mhz, v r =4.0v rating for fusing i 2 t 5.0a 2 s t<8.30ms operating junction and storage temperature range t j t stg -55to+150 notes: 1. high temperature solder exemption applied, see eu directive annex notes 7 mbs -1
.252 .272 6.40 6.90 6 2.70 .019 .031 0.50 0.80 .090 .106 2.30 2.70 .004 .008 0.10 0.20
.027 .043 0.70 1.10 .058 .062 1.47 1.57 .195 .205 4.95 5.21 notch in case b c d a f g h e + - k j m n c .150 .165 3.80 4.20 d .179 .195 4.55 4.95 revision: 15 2010/09/14
omp onents 20736 marilla street chatsworth
mcc 0.272max. (6.91max.) 0.105 (2.67) 0.095 (2.41) 0.030 min. (0.76 min.) 0.023 min. (0.58 min.) mounting pad layout ? glass passivated diode construction ? high temperature soldering guaranteed:260 c/10 second ? saves space on printed circuit board ? epoxy meets ul 94 v-0 flammability rating and msl rating 1 per j-std-020c ? teminals: plated leads solderable per mil-std-750,method 2026 www. mccsemi .com 1 of 3 o c 5ua o c o c o c o c o c m .039 .049 0.99 1.24 n .006 .016 0.15 0.41 tm micro commercial components ? lead free finish/rohs compliant (note 1)("p" suffix designates rohs compliant. see ordering information) 2. on glass epoxy p.c.b. mounted on 0.05 x 0.05(1.3 x 1.3mm)pads 3. on aluminum substrate p.c.b. with an area of 0.8 x 0.8(20 x 20mm) mounted on 0.05 x 0.05(1.3x 1.3mm) solder pad ~ ~ - + case style x ul recognized file # e165989 o
mb05s thru mb10s instantaneous reverse leakage current - microamperes versus ereeeeversees seusrrurreeres versus seusrres ure rrrerss s s ure eversererss s s mcc revision: 15 2010/09/14 1 100 4 0 10 20 30 8 figure 5 peak forward surge current peak forward surge current - amperes versus ueres 5 5 www. mccsemi .com 2 of 3 figure 1. derating curve for output rectified current 0 20 40 60 80 100 120 140 160 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 aluminum substrate glass epoxy p. c . b . resistive or inductive load average for ward rectified c urrent (a) ambient temperature (c)
mcc revision: 15 2010/09/14 tm micro commercial components www. mccsemi .com 3 of 3 ordering information device packing (part number)-tp tape&reel; 3kpcs /reel products are represented on our website, harmless against all damages. ***life support*** ***important notice*** without the expresse written approval of micro commercial components corporation. mcc's products are not authorized for use as critical components in life support devices or systems micro commercial components corp . reserves the right to make changes without further notice to any product herein to make corrections, modifications , enhancements , improvements , or other changes . micro commercial components corp . does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights ,nor the rights of others . the user of products in such applications shall assume all risks of such use and will agree to hold micro commercial components corp . and all the companies whose
|
